| 摘要 |
Semiconductor device fabrication methods include forming an oxide layer on a semiconductor substrate, forming an arrangement trench on the semiconductor substrate by patterning the oxide layer and the semiconductor substrate, forming a nitride layer on the arrangement trench and the oxide layer, forming a field trench on the semiconductor substrate by patterning the nitride layer, oxide layer, and the semiconductor substrate, and forming a pad oxide layer on inner walls of the field trench. The methods may also include removing the pad oxide layer on a bottom wall of the field trench, injecting ions into the bottom wall of the field trench so as to form an ion injected region, forming a buried layer by diffusing the ion injected region, and forming an epitaxial layer on the buried layer.
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