发明名称 METHOD AND DEVICE FOR TREATING SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To remove at least either of a metallic film or metallic pollution on a peripheral section and a rear face of a substrate without eroding a wiring protective film formed on the substrate by a washing liquid or the like. SOLUTION: The approximately central section of a substrate surface is supplied with a non-oxidizing fluid, horizontally holding the substrate and rotating the substrate in the horizontal direction. At least either of the peripheral section and rear face of the substrate is supplied with the washing liquid. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005174961(A) 申请公布日期 2005.06.30
申请号 JP20030408214 申请日期 2003.12.05
申请人 EBARA CORP 发明人 ONO HARUKO;KAJITA SHINJI
分类号 H01L21/3205;H01L21/02;H01L21/304;H01L23/52;(IPC1-7):H01L21/304;H01L21/320 主分类号 H01L21/3205
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