发明名称 |
Chemical leadframe roughening process and resulting leadframe and integrated circuit package |
摘要 |
Chemical Leadframe Roughening Process and Resulting Leadframe and Integrated Circuit Package A chemical leadframe roughening process includes cleaning and chemically micro-etching a raw copper leadframe to remove organic material and oxide material from the surface. The surface of the leadframe is then roughened using an organic and peroxide solution, resulting in a finely pitted surface morphology. The roughened leadframe is cleaned to remove organic material, and then is plated with a lead-free plating material (such as a layered plating of nickel-palladium-gold (NiPdAu)) having a reflow temperature higher than the reflow temperature of lead-based solder. The plated leadframe exhibits the desired finely pitted morphology that is believed to provide for greater bonding with the mold compound used to make a finished integrated circuit package, thereby improving the moisture sensitivity level (MSL) performance of the package. |
申请公布号 |
US2005139968(A1) |
申请公布日期 |
2005.06.30 |
申请号 |
US20040941412 |
申请日期 |
2004.09.15 |
申请人 |
YAP YOON F.;CHEE MOSES M.S. |
发明人 |
YAP YOON F.;CHEE MOSES M.S. |
分类号 |
C23F1/18;C25D5/34;H01L21/48;H01L23/495;(IPC1-7):H01L23/495 |
主分类号 |
C23F1/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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