| 发明名称 |
SILICONE ADHESIVES |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide silicone adhesives without decreasing the wire bondability and without reducing the adhesiveness among the surface of a semiconductor pellet, a lead frame and a sealing resin. <P>SOLUTION: The silicone adhesives for bonding the semiconductor pellet and a pellet fitting member comprises an addition reaction curing type silicone rubber composition the contamination of which onto a glass plate at heating and curing is expressed that a contact angle to water on the glass plate is 70° or below. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
| 申请公布号 |
JP2005175119(A) |
申请公布日期 |
2005.06.30 |
| 申请号 |
JP20030411502 |
申请日期 |
2003.12.10 |
| 申请人 |
GE TOSHIBA SILICONES CO LTD |
发明人 |
TAMURA TAKERU;HIRAI NOBUO |
| 分类号 |
C09J11/04;C09J183/04;C09J183/07;C09J201/00;H01L21/52;H01L23/495 |
主分类号 |
C09J11/04 |
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