SEMICONDUCTOR MODULE, SEMICONDUCTOR DEVICE AND LOAD DRIVER

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor module capable of suppressing distortion generated by a thermal expansion difference between a power semiconductor element and an electrode substrate, and to provide a semiconductor device and a load driver.

SOLUTION: Electrode substrates 302 and 304 clamp a power transistor Q3 and a reverse parallel diode D3 from both sides. Overall dimensions of the surface of the electrode substrates 302 and 304 facing heat sinks 312 and 314 can be designed larger than overall dimensions of the surface of the heat sinks 312 and 314 facing the electrode substrates 302 and 304. Consequently, mold resin 320 spreads to sides of the electrode substrates 302 and 304 not mounting the element and presses the electrode substrates 302 and 304 against the power semiconductor element.

COPYRIGHT: (C)2005,JPO&NCIPI