METHOD AND DEVICE FOR FORMING METAL WIRING, CONDUCTIVE FILM WIRING, CONDUCTIVE FILM WIRING, THIN FILM TRANSISTOR, ELECTRO-OPTIC DEVICE, ELECTRONICS, AND NON-CONTACT CARD MEDIUM

摘要

PROBLEM TO BE SOLVED: To provide a method and a device for forming wiring and conductive film wiring etc. that control occurrence of defect such like a breakdown or a short-circuit in wirings formed by an ink-jet method. SOLUTION: In this method, drops L1 and L2 composed of a liquid, in which conductive fine particles are dispersed in a dispersion medium, are spattered on a predetermined area of a substrate 11 to form wirings W1, W2, and W3. The method include a first arrangement process for arranging the drops L1 at an arrangement pitch H1 with which two adjacent drops L1 are not overlapped, a process for removing the dispersion medium of the drops L1, and a second arrangement process for arranging the drops L2 so that the spaces between drops L1 are occupied with them. COPYRIGHT: (C)2005,JPO&NCIPI