| 摘要 |
PROBLEM TO BE SOLVED: To fill an underfill without any voids or without coating irregularities in an electronic component packaging structure of a substrate sealed by the underfill. SOLUTION: In the packaging structure in which electronic components 3 are mounted on the substrate 1 in which a plurality of conductive section regions 2 that oppose a plurality of terminals 4 are formed and the underfill 7 is filled, each conductive section region 2 has a shape for making a flow smooth when filling the underfill 7, or a shape for allowing the flow to have directivity, namely a teardrop shape, an elliptical shape, a diamond shape, and its approximated shape. COPYRIGHT: (C)2005,JPO&NCIPI
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