| 摘要 |
A wafer protection device. The wafer has a first surface etched with an etching fluid and a second surface, and the wafer protection device is applied to the wafer to prevent a specific area on the second surface of the wafer from etching. The wafer protection device has a body and a pressure modulating device. The body covers the specific area of the wafer and provides an isolated cavity between the body and the specific area to prevent the specific area from contacting the etching fluid, and the pressure modulating device is provided on the body and connected to the isolated cavity to modulate pressure in the isolated cavity.
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