| 摘要 |
PROBLEM TO BE SOLVED: To provide grooving process and equipment capable of performing grooving stably, while following up the displacement state of the machining surface of a workpiece. SOLUTION: In the grooving process, a semiconductor wafer 8 is moved, while pressing a tool 6 against the surface thereof thus forming a groove for cleaving/separating the work in that surface. When grooving is performed, while supporting the tool resiliently in the receding direction for the work surface and also resiliently supporting it in the inclining or twisting direction, approaching/receding motion, inclination or twisting of the tool is suppressed in correspondence with the displacement state of the work surface, the tool follows up the displacement state of the work surface, to absorb pressure variation at grooving, the attitude of the tool is not affected by the displacement state of the work surface at follow-up and machining is performed, while sustaining that attitude. Consequently, damages to the work due to excessive machining pressure is suppressed, and marked variations in the groove width or groove depth due to variation in tool attitude are suppressed. COPYRIGHT: (C)2005,JPO&NCIPI |
