| 发明名称 |
Chip package structure |
| 摘要 |
A chip package structure is disclosed. The chip package structure includes an inner molding compound with a low modulus covering the chip and an outer molding compound covering the inner molding compound. The outer molding compound has a modulus larger than then modulus of the inner molding compound.
|
| 申请公布号 |
US2005140005(A1) |
申请公布日期 |
2005.06.30 |
| 申请号 |
US20040023354 |
申请日期 |
2004.12.29 |
| 申请人 |
ADVANCED SEMICONDUCTOR ENGINEERING INC. |
发明人 |
HUANG YA-LING;LIN TZU-BIN;HSU HUNG-TA |
| 分类号 |
H01L23/31;(IPC1-7):H01L21/44;H01L23/52 |
主分类号 |
H01L23/31 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
