发明名称 |
Semiconductor water manufacturing method and wafer |
摘要 |
The present invention provides a method for manufacturing a semiconductor wafer capable of manufacturing a wafer without ring-like sag in an outer peripheral portion thereof when polishing an alkali etched wafer, and a wafer without the ring-like sag in an outer peripheral portion thereof. The present invention comprises: a back surface part polishing and edge polishing step for performing back surface part polishing and edge polishing such that mirror polishing is performed on a chamfered portion and an inner part extending inward from a boundary between the chamfered portion and a back surface of a starting wafer; and a front surface polishing step for mirror polishing a front surface of the wafer subjected to the back surface part polishing and edge polishing step holding the wafer by the back surface thereof.
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申请公布号 |
US2005142882(A1) |
申请公布日期 |
2005.06.30 |
申请号 |
US20040512637 |
申请日期 |
2004.10.27 |
申请人 |
KIDA TAKAHIRO;MIYAZAKI SEIICHI;NISHIMURA KAZUHIKO;HAYASHI NOBUYUKI;ARAI KATSUNORI |
发明人 |
KIDA TAKAHIRO;MIYAZAKI SEIICHI;NISHIMURA KAZUHIKO;HAYASHI NOBUYUKI;ARAI KATSUNORI |
分类号 |
B24B9/00;B24B9/06;B24B37/04;H01L21/302;H01L21/304;H01L21/306;(IPC1-7):H01L21/302;H01L21/461 |
主分类号 |
B24B9/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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