发明名称 Inductive sensor with conductive path(s) on circuit board, forming at least part of coil to which is allocated coil core, with circuit board of multilayer type, with outer layer carrying contacted conductive path sections
摘要 <p>Inductive sensor contains conductive paths (24,26) on circuit board (16,18), forming at least part of coil, to which is allocated coil core (20). Circuit board is of multilayer type with outer layers (16,18) carrying conductive path sections.Contacts (28) are used to connect conductive path sections, thus forming complete coil. Coil core (20,22) is sandwiched by outer layers. Typically coil core is foil (22) of amorphous metal. Each outer layer may be separate circuit board fitted with further electronic components, e.g. evaluating circuit.</p>
申请公布号 DE10354694(A1) 申请公布日期 2005.06.30
申请号 DE2003154694 申请日期 2003.11.22
申请人 SICK AG 发明人 BAAK, JOSEF;MACHUL, OLAF
分类号 F15B15/28;G01D5/20;H05K1/16;H05K3/46;(IPC1-7):G01D5/20;G01B7/02 主分类号 F15B15/28
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