CHEMICAL-AMPLIFICATION POSITIVE-WORKING PHOTORESIST COMPOSITION

摘要

Disclosed is a chemical-amplification positive-working photoresist composition having compliability to various types of resist patterns with excellent sensitivity and pattern resolution exhibiting high exposure margin and focusing depth latitude. Of the essential components including (A) a resin capable of being imparted with increased alkali-solubility by interacting with an acid and (B) an acid-generating compound, the component (A) is a combination of (a1) a first resin and (a2) a second resin each as a hydroxystyrene-based copolymeric resin partially substituted for the hydroxyl hydrogen atoms with acid-dissociable solubility-reducing substituent groups. Characteristically, in addition to the difference in the mass-average molecular weight being high for (a1) and low for (a2), the acid-dissociability of the substituents in the (a1) resin is higher than that in the (a2) resin as in a combination of 1- ethoxyethyl for (a1) and tetrahydropyranyl for (a2).