| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device and a manufacturing method thereof whose resin post has easy deformability independently of its direction and can sufficiently exhibit its stress absorbency caused by its deformability. <P>SOLUTION: The manufacturing method of the semiconductor device has a process for forming a seed layer on the top surface of a resin post 4 raised protrusively above a conductive substrate 1 via an insulating resin layer 3, a process for forming a resist film on the seed layer except for a linear region provided spirally along the side surface 4b of the resin post 4, a process for forming a conductive layer 7 in the linear region, and a process for removing the resist film and the seed layer positioned below the resist film. Thus, the semiconductor device 11 is obtained by so providing the linear conductive layer 7 spirally along the side surface 4b of the resin post 4 as to connect its one end with a first conductive portion 5 provided in a continuity-able way with the surface of the conductive substrate 1, and as to connect its other end with a second conductive portion 6 provided in a vertex portion 4a of the resin post 4. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
