| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To obtain a semiconductor device excellent in reliability using a liquefied sealing resin composition few in voids and high in flux activity. <P>SOLUTION: The manufacturing method of a semiconductor substrate manufactures the semiconductor device by applying the epoxy resin composition on a semiconductor chip or a circuit board where solder bump electrodes are formed on a circuit surface, positioning the circuit board and the semiconductor chip such that the electrodes are electrically joined with each other via the epoxy resin composition, then electrically joining the bump electrodes and the circuit board by heating them to a melting point or higher of a solder, and further curing the resin. In the method, the epoxy resin composition takes as essential ingredients, (A) epoxy resin, (B) a first curing agent having the flux activity, and (C) a second curing agent having the flux activity. The melting point of the first curing agent (B) is below the melting point of the solder +30°C and above the melting point of the solder -30°C. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
