发明名称 SUBSTRATE PROCESSING APPARATUS AND CONTROLLING METHOD THEREFOR
摘要 PROBLEM TO BE SOLVED: To shorten startup time for cost reduction in an application development apparatus having an inspection section, and to improve on the working rate of the inspection section. SOLUTION: The program for an application development apparatus 1 is so set that a processing flow F<SB>1</SB>, wherein a wafer W is carried from a cassette station 2 to a processing station 4 for processing at the processing station 4 and at an exposure apparatus and is then returned to the cassette station 2, and an inspection flow F<SB>2</SB>, wherein a wafer W is carried from the cassette station 2 to an inspection station 3 for inspection and is then returned to the cassette station 2, are implemented independently from each other. The inspection flow F<SB>2</SB>and the processing flow F<SB>1</SB>are implemented at startup and, at the same time, the inspection unit of the inspection station 3 is evaluated and the processing unit of the processing station 4 is adjusted. A wafer W is carried from the outside into the cassette station 2 for inspection when the inspection station 3 is empty. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005175052(A) 申请公布日期 2005.06.30
申请号 JP20030410105 申请日期 2003.12.09
申请人 TOKYO ELECTRON LTD 发明人 SHINOZUKA SHINICHI;WADA YOSHIMARE;YAMASHITA TAKEHIDE
分类号 G05B19/418;G03F7/16;G03F7/30;H01L21/00;H01L21/02;H01L21/027;H01L21/677;(IPC1-7):H01L21/027;H01L21/68 主分类号 G05B19/418
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