| 摘要 |
A microchip wire bonder for bonding insulated bond wire to a surface, the microchip wire bonder comprising: a) a body having a stationary electrical contact configured to receive an electrical potential; b) a bond head attached to the body, to position the insulated bond wire adjacent to the surface; c) a rotating wire spooler attached to the body, to hold the insulated bond wire and to advance the insulated bond wire from the spooler to the bond head as needed; and d) an electrical contact device comprising: i) a rotating electrical connector fixed to the rotating wire spooler and being sized and shaped to receive an electrical connection with an uninsulated portion of the insulated bond wire at one end, and having a moving electrical contact at the other end, the two ends being electrically connected; and ii) a conductive bearing configured to electrically couple the moving electrical contact of the electrical connector and the stationary electrical contact; wherein, upon connecting the stationary electrical contact to an electrical potential, and upon connecting the bond wire to the electrical connector, the insulated bond wire will acquire the electrical potential.
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