| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat-resistant resin composition which retains excellent low-temperature adhesivity even after having a high-temperature process, without thermally setting the resin, and to provide a polyimide metal laminate which exhibits excellent low-temperature workability even after having a high-temperature process. SOLUTION: The resin composition is obtained by compounding a polyamide acid and/or a polyimide, with a bismaleimide compound expressed by formula (1), exhibiting an exothermic peak top of at least 300°C by DSC measurement (in the formula, m is an integer of at least 1; X are each independently the same or different, and each of them is a hydrocarbon group, ester group, amide group, O, CO, SO<SB>2</SB>, S, C(CF<SB>3</SB>)<SB>2</SB>or direct bond; and R1 are the same or different and each a hydrogen atom, a halogen atom, a hydroxy group or a hydrocarbon group, wherein substitution positions are mutually independent). The metal laminate is prepared by laminating the resin composition onto at least either face of a metal foil. COPYRIGHT: (C)2005,JPO&NCIPI |
