WAFER LEVEL ELECTRONIC MODULE WITH INTERIOR CONNECTOR CONTACT AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a wafer level electronic module with an interior connector contact and to provide its manufacturing method. SOLUTION: The electronic module 400 includes a monolithic substrate with at least one integrated circuit die. The monolithic substrate is disposed on at least one integrated circuit die and includes a redistribution structure which provides a connect contact 230a coupled to at least one integrated circuit die. The redistribution structure may be configured to provide a passive electronic device electrically coupled to at least one integrated circuit die and/or may comprise at least one conductive layer configured to provide electrical connection to a contact pad of an electronic device mounted on a substrate 100. COPYRIGHT: (C)2005,JPO&NCIPI