| 摘要 |
PROBLEM TO BE SOLVED: To provide a metal mask for forming solder electrodes for high density mounting on a wafer or a printed-circuit board and so on, especially for finely forming solder bump electrodes with high density using screen printing, which has minute openings having smooth wall surfaces with high density, therefore, at the cream solder printing, the metal mask shows superior natures of coming-off from openings of the cream solder and detaching from print, and defects such as spreading of cream solder, chipping, coming-off or cracking of formed solder electrodes are prevented, even if lead free cream solder is printed, and moreover, the printing can be performed with high speed and precise positions of the openings of the metal mask is maintained during continuous and repeating printing, and to provide a manufacturing method for the metal mask, without requiring complicated process. SOLUTION: The metal mask is manufactured by using plating method. When a pattern, corresponding to the openings is formed on an electrically conductive substrate using photopolymer by photolithographic method, exposure is performed by directly irradiating the photopolymer with a focused scanning ultraviolet laser light. COPYRIGHT: (C)2005,JPO&NCIPI
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