| 摘要 |
PROBLEM TO BE SOLVED: To provide a polyacetal resin composition excellent in thermal stability, suppressed in an amount of generated formaldehyde and giving a small amount of mold deposit. SOLUTION: The polyacetal resin composition comprises (A) a polyacetal resin, (B) 0.01-0.9 pt. wt. of an alkylene urea, (C) 0.01-5 pts. wt. of an aliphatic hydrazide compound having a solubility of less than 1 g in 100 g H<SB>2</SB>O at 20°C, (D) 0.01-5 pts. wt. of a sterically hindered phenol, (E) 0.01-7 pts. wt. of an amino-substituted triazine compound and (F) 0.004-5 pts. wt. of at least one metal-containing compound selected from among hydroxides, inorganic acid salts and alkoxides of alkali metals and alkaline earth metals, the (B)/(C) weight ratio being 0.1-2. COPYRIGHT: (C)2005,JPO&NCIPI
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