发明名称 |
MOSFET performance improvement using deformation in SOI structure |
摘要 |
A method for manufacturing a semiconductor device is provided. The method includes forming a semiconductor layer on a substrate. The first region of the substrate is expanded to push up the first portion of the semiconductor layer, thereby applying tensile stress to the first portion. The second region of the substrate is compressed to pull down the second portion of the semiconductor layer, thereby applying compressive stress to the second portion. An N type device is formed over the first portion of the semiconductor layer, and a P type device is formed over the second portion of the semiconductor layer.
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申请公布号 |
US2005142788(A1) |
申请公布日期 |
2005.06.30 |
申请号 |
US20050065061 |
申请日期 |
2005.02.25 |
申请人 |
CHIDAMBARRAO DURESETI;DOKUMACI OMER H. |
发明人 |
CHIDAMBARRAO DURESETI;DOKUMACI OMER H. |
分类号 |
H01L21/762;H01L21/84;H01L27/12;(IPC1-7):H01L29/06;H01L21/331;H01L21/822;H01L31/032;H01L31/033;H01L31/072;H01L31/109 |
主分类号 |
H01L21/762 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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