发明名称 SOLID-STATE IMAGING DEVICE, ITS PRODUCTION METHOD, CAMERA WITH THE SOLID-STATE IMAGING DEVICE, AND LIGHT-RECEIVING CHIP
摘要 A light-receiving chip having a transparent protective plate the area of which can be smaller than that of the light-receiving chip and needing no base portion for mounting. This light-receiving chip leads to reduction of the size and weight of a camera. Further providing a solid-state imaging device excellent in productivity leads to reduction of the price of a camera. The solid-state imaging device is characterized in that a solid-state imaging device (10) comprises a solid-state imaging element (light-receiving chip) (11) having an arrangement where light-receiving cells are linearly or two-dimensionally arranged on one major surface of a base substrate and a transparent protective plate (12), the transparent protective plate is so provided on the major surface as to cover the light-receiving region (18) (light-receiving cells), the area of the transparent protective plate is smaller than that of the light-receiving chip, and a gap (20) is defined between the light-receiving cells and the transparent protective plate.
申请公布号 WO2005060004(A1) 申请公布日期 2005.06.30
申请号 WO2004JP18927 申请日期 2004.12.17
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO.,LTD.;MURATA, TAKAHIKO;KASUGA, SHIGETAKA;YAMAGUTI, TAKUMI 发明人 MURATA, TAKAHIKO;KASUGA, SHIGETAKA;YAMAGUTI, TAKUMI
分类号 H01L23/02;H01L27/14;H01L27/146;H01L31/02;H01L31/0203;H04N5/225 主分类号 H01L23/02
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