| 摘要 |
<P>PROBLEM TO BE SOLVED: To reduce the temperature of a hot spot of a chip by locally reducing the layer thickness of a compliant thermally conductive material on the chip. <P>SOLUTION: In an integrated circuit package structure within MCM or SCM, a compliant thermally conductive material is applied between a heat-producing integrated circuit and a substrate attached thereto. A thinner layer of the compliant thermally conductive material is arranged between the chip and the substrate in this region after assembling, and as a result, a raised region aligned to a high power density region higher than the average on the active front surface of the chip is defined at the backside of the chip so that the temperature of the "hot spot" on the chip is reduced. In an exemplary embodiment, the substrate comprises one of a heat sink, cooling plate, heat spreader, heat pipe, heat hat, package lid, and other cooling members. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
