| 摘要 |
<P>PROBLEM TO BE SOLVED: To reduce the cost by improving a simple substance making process of an aggregate substrate. <P>SOLUTION: A method for manufacturing a package 1 for an SMD type LED is provided with a process for forming an aggregate alumina substrate 12 from which many alumina substrates 2 having break lines 21 are taken, a process for forming an aggregate resin substrate 14 from which many resin substrates 4 are taken, a process for processing break lines 22 for cutting the aggregate resin substrate 14 to individuals, a process wherein the aggregate alumina substrate 12 having the respective break lines 21 and the resin substrate 14 having the respective break lines 22 are joined and an aggregate package 11 is formed from which many packages 1 are taken, and a process wherein simple materials are formed by cutting the aggregate package 11 along the respective break lines 21, 22. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
