| 摘要 |
PROBLEM TO BE SOLVED: To provide a high-frequency device that is superior in heat dissipation and is compact in size. SOLUTION: A Peltier element 11 is fitted so that the surface of endothermic side thereof may be in contact with a PSK demodulation IC 13, and the surface of heat dissipation side thereof may be in contact with a heat pipe 12 as a pipe-shaped member wherein a medium made of a thermal conductive material for evaporation and condensation is sealed. The end 12a of the heat pipe 12 is led to the outside of a tuner 1 through a small hole 7c made on a shield case 7, it is exposed in an open air within a cabinet 6, and the end face 12b of the heat pipe 12 is arranged so as to be in contact with the cabinet 6. COPYRIGHT: (C)2005,JPO&NCIPI
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