| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board which has strong adhesion having an integrated circuit chip by increasing the adhesion in the interface between an adhesive used for packaging the integrated circuit chip and the wiring board, and to provide an electronic circuit element and a display. SOLUTION: In a region of a base film 4, where an NCP 9 used for packaging the integrated circuit chip 1 at packaging of the chip 1 is located, through-holes 40 extended through the base film 4 are formed. By attaching a cover lay 6 with an adhesive to the rear face of the base film 4, in such a way as to cover the through-holes 40, the through-holes 40 are filled with an adhesive 6b used in the cover layer 6 with adhesive. The adhesive 6b, filling the through-holes 40 and the NCP 9, are adhere strongly to each other, at the packaging of the integrated circuit chip 1. COPYRIGHT: (C)2005,JPO&NCIPI
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