| 摘要 |
The present invention relates to thermoplastic polyamide moulding compositio ns with reduced or strongly reduced formation of solid deposits and/or coverings during thermoplastic containing at least 20% by weight polyamide and/or at least one copolymer with at least 20 % by weight polyamide components, 0.05% by weight up to maximum 3.0% by weight, each related to the total mass of the polyamide matrix-component, at least one compound selected from the group consisting of benzene sulfonic acid alkylamides, o-, p-toluene sulfonic acid alkylamides, alkylhydroxy benzoates, benzoic acid esters, hydroxybenzene carboxylic acid esters, benzene carboxylic acid esters, phthalic acid esters, fatty acid esters, esters of polyhydric alcohols, dicarboxylic acid diesters with a C-number of the acids from 4 to 12 atoms, trialkylmellitic acid esters, phosphoric acid esters, citric acid esters, tetraalkylethylene diamines, tetra (2- hydroxyalkyl) allrylenethylene diamines, fully substituted hydroxyalkyethyle ne diamines, trialkylamines or fully substituted trialkylethylene diamines and mixtures o f the afore mentioned compounds and/or 0,05% by weight up to maximum 3.0% by weight, preferably 0. 1% up to 2.0% by weight, more preferably 0.15% by weight up to 1.0%, each related to the total mass of the polyamide matrix-component, at least one aprotic compound selected from the group of N- alkylated, cyclic carbonic acid amides with 5 to 7 ring elements and/or the group of urea derivatives, the alkyl rests of which are linear or branched at the nitrogen and which, if necessary, can contain heteroatoms and heterogroups or which form a linking of the two N- atoms..
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