| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor light emitting element equipped with texture suitable for dividing a substrate into chips by little external force, and to provide its manufacturing method. <P>SOLUTION: A process wherein a light emitting layer 12 having pn junction is formed on a main surface of a substrate 11, a process wherein the substrate 11 is irradiated with high energy particle beam 20 in a grid pattern, a process wherein electrodes 22, 23, 24 for electrical connection to the light emitting layer 12 are formed inside of a region 21 irradiated with the high energy particle beam 20 in the grid pattern, and a process wherein dicing of the substrate 11 is performed along the region 21 which is irradiated with the high energy particle beam 20 in the grid pattern to split into a plurality of the chips. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
