| 摘要 |
<P>PROBLEM TO BE SOLVED: To reduce unevenness of a card, prevent card bubble, improve adhesiveness, and improve durability. <P>SOLUTION: The IC card, which is structured with multiple layers, is manufactured by coating with adhesive between a first sheet material 1 and a second sheet material 2 to encapsulate an IC module formed on a support body in the adhesive layer, wherein the thickness of the support body to form the IC module is no less than 10 μm and not more than 100 μm, and furthermore, the impurity content in IC chip materials comprising the IC module is not more than 0.001 wt.%. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
