| 摘要 |
PROBLEM TO BE SOLVED: To provide a flexible wiring board firstly having excellent characteristics such that no exudation of an adhesive occurs, opening accuracy and positional precision are excellent, mechanical and electrical characteristics are excellent, and plating resistance is excellent, etc., thus achieving both advantages of a cover-lay film and a solder resist, and secondly easily realizable with reduced man-hours. SOLUTION: This flexible wiring board 1 wholly or partially has an insulating passivation layer 6 with two-layered structure as a protection film for a circuit pattern 3. Further, the cover-lay film 7 is adopted as the outer layer of the two-layered structure, and the solder resist 8 is adopted as the underlying layer of the two-layered structure. As the outer layer cover-lay film 7, a pre-punched cover film 9 or a photograph-type photosensitive cover film 10 is used. As the solder resist 8 of the underlying layer, a photograph-type photosensitive resist 11 or a print-type print resist is used. COPYRIGHT: (C)2005,JPO&NCIPI
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