| 发明名称 |
ELECTRONIC COMPONENT PACKAGING STRUCTURE AND ITS MANUFACTURING METHOD |
| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an electronic component packaging structure which has an electronic component buried in an inter-layer insulating film on a wiring board, and which is prevented from decreasing in yield even if the inter-layer insulating film cracks. <P>SOLUTION: The electronic component 20 having a corner at its outer periphery is packaged on the wiring board, a pattern 13 for cracking protection is arranged nearby outside at least the corner at the outer periphery of the electronic component 20, and the electronic component 20 and pattern 13 for cracking protection are coated with an insulating film 14a. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
| 申请公布号 |
JP2005175304(A) |
申请公布日期 |
2005.06.30 |
| 申请号 |
JP20030415390 |
申请日期 |
2003.12.12 |
| 申请人 |
SHINKO ELECTRIC IND CO LTD |
发明人 |
WATANABE SHOJI;HARUHARA MASAHIRO |
| 分类号 |
H01L23/12;(IPC1-7):H01L23/12 |
主分类号 |
H01L23/12 |
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