LASER DICING APPARATUS AND DICING METHOD

摘要

PROBLEM TO BE SOLVED: To provide laser dicing apparatus and method by which a thick wafer also can be stably diced.

SOLUTION: The laser head 40 of the laser dicing apparatus 10 is provided with a laser oscillator 21, a condenser lens 24 and a linear fine movement means consisting of a piezoelectric element for finely sending the condenser lens 24 back and forth in parallel with a wafer W and the wafer W is repeatedly irradiated with laser light while oscillating the laser light in an X direction which is a working direction.

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