| 发明名称 |
CHEMICAL-MECHANICAL PLANARIZATION COMPOSITION HAVING PVNO AND RELATIVE OPERATION METHOD |
| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a chemical-mechanical planarization composition having a PVNO with a high copper removal speed satisfying a requisite for throughput first and the excellent uniformity of the topography of the entire substrate secondly, and a relative operation method. <P>SOLUTION: This composition comprises an abrasive and a polyvinyl pyridine-N-oxide polymer. This composition possesses high selectivities for metal and barrier material removal in metal CMP. This composition can further comprise an oxidizing agent. In that case, this composition is particularly useful in conjunction with the relative method for metal CMP applications (e.g., copper CMP). <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
| 申请公布号 |
JP2005175437(A) |
申请公布日期 |
2005.06.30 |
| 申请号 |
JP20040296557 |
申请日期 |
2004.10.08 |
| 申请人 |
DUPONT AIR PRODUCTS NANOMATERIALS LLC |
发明人 |
SIDDIQUI JUNAID AHMED;FU BIN |
| 分类号 |
B24B37/00;B24B1/00;C09G1/02;C09K3/14;H01L21/304;H01L21/321;(IPC1-7):H01L21/304 |
主分类号 |
B24B37/00 |
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