发明名称 LAMP HEAT TREATMENT APPARATUS
摘要 PROBLEM TO BE SOLVED: To solve the problem in the conventional lamp heat treatment apparatus in which an interior of a metal chamber is not sufficiently warmed even if pre-heating is carried out, wherein a heating lamp group is turned on before the heat treatment of a first substrate when a plurality of semiconductor substrates are to be processed successively, so that the thickness of the formed film will be thinner for the first substrate than for the second and subsequent substrates even if pre-heating is carried out. SOLUTION: In the lamp heat treatment apparatus, the heating lamp group has a function to heat not only the semiconductor substrates but also the metal chamber. Thus, the interior of the metal chamber is sufficiently warmed by turning the heating lamp group on to carry out the pre-heating. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005175192(A) 申请公布日期 2005.06.30
申请号 JP20030413002 申请日期 2003.12.11
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 UCHIYAMA KEITA
分类号 F27B17/00;H01L21/205;H01L21/26;(IPC1-7):H01L21/205 主分类号 F27B17/00
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