| 摘要 |
PROBLEM TO BE SOLVED: To provide an immersion exposure method having a highly precise wafer Z position measuring method and a Z position control method, and to provide a device manufacturing technology to manufacture a high performance device by using the exposure technology. SOLUTION: The measuring electrode of an electric capacity type position detecting device is arranged in a projection optical system or its neighborhood, the electric capacity of the capacity formed between the measuring electrode and the wafer is measured, and the focus control of a substrate to be exposed is executed based on this. A conductive thin film is formed on the surface of the substrate to be exposed so that the electric capacity can be limited to the electric capacity of the capacity formed between the measuring electrode and the conductive thin film, and that the fluctuation of the electric capacity accompanied with the structure of the substrate to be exposed can be prevented. COPYRIGHT: (C)2005,JPO&NCIPI
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