| 摘要 |
PROBLEM TO BE SOLVED: To provide a double sided circuit board and its manufacturing method by which a blind via hole and an optional hole of different shapes are simultaneously formed at intended positions and mass productivity is improved. SOLUTION: A double sided circuit board is obtained by simultaneously forming a blind via hole and a through hole in a substrate of a double sided metal lamination by laser processing, providing a shielding function against electromagnetic waves to the side faces of the through hole, forming a metallic patterns on both faces, and applying metal plating to exposed metallic parts. Manufacturing methods are provided for a double sided circuit board which is formed by working on continuous holes by a reel-to-reel method, and a double sided circuit board which has flexibility and uses thin film-like layer with an easily peeled off adhesive. COPYRIGHT: (C)2005,JPO&NCIPI
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