| 摘要 |
PROBLEM TO BE SOLVED: To arrange a predetermined capacitance between power supplies in a chip even if core transistors are integrated with high density. SOLUTION: The semiconductor device comprises a plurality of core transistors 100 arranged in a chip, a plurality of I/O cells 10 arranged to surround the plurality of core transistors 100, power supply lines 12 and ground lines 14 of the plurality of core transistors 100, and capacitive element lines 42 and 44 for connecting the power supply lines 12 and the ground lines 14 such that at least one of dummy transistors, i.e. the transistors adjacent to the I/O cell 10 among the plurality of core transistors 100, functions as a capacitive element 200 between power supplies provided between the power supply line 12 and the ground line 14. COPYRIGHT: (C)2005,JPO&NCIPI
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