| 摘要 |
PROBLEM TO BE SOLVED: To provide a polishing method of a wafer with which polishing waste is prevented from adhering between the wafer at the outer periphery of the wafer and a protection tape when the protection tape is stuck to the surface of the wafer and backside is dry-polished. SOLUTION: When the protection tape (P) is to be stuck to a face to be held (10) of the wafer held by a chuck table of a polishing device, the outer periphery of the protection tape (P) is projected from the outer periphery of the wafer (W). A protection tape-side is placed on the chuck table, and the face of the wafer is dry-polished. COPYRIGHT: (C)2005,JPO&NCIPI
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