RESIN COMPOSITION FOR PRINTED WIRING BOARD, AND RESIN VARNISH USING THE RESIN COMPOSITION, PREPREG AND LAMINATED BOARD

摘要

PROBLEM TO BE SOLVED: To obtain a printed wiring board excellent in low thermal expansion property without lowering dielectric properties. SOLUTION: The printed wiring board as a laminated board excellent in dielectric properties and low thermal expansion property is obtained by impregnating a glass woven fabric or glass nonwoven fabric with a varnish compounded with (a) a thermosetting resin and (b) noncrystalline glass of low dielectric loss as the essential components, followed by drying the resultant fabric to obtain a prepreg followed by hot-pressing the prepreg. COPYRIGHT: (C)2005,JPO&NCIPI