发明名称 METHOD FOR BONDING OLEFINIC RESIN
摘要 PROBLEM TO BE SOLVED: To provide a method for the bonding to an olefinic substrate to give higher adhesiveness-improving effect compared with plasma irradiation and corona discharge treatment. SOLUTION: A substrate made of an olefinic resin is coated with a solution-type primer composed mainly of a chlorinated polyolefin, the primer is dried to form a coating layer of the chlorinated polyolefin, a thermally fusible layer of a moisture-setting reactive hot-melt adhesive composed mainly of an isocyanate-containing urethane prepolymer and having a melting point of 40-150°C is formed on the coating layer and the substrate composed of the olefinic resin is bonded to an adherend through the coating layer of the chlorinated polyolefin and the thermally fusible layer. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005171162(A) 申请公布日期 2005.06.30
申请号 JP20030415708 申请日期 2003.12.12
申请人 TOAGOSEI CO LTD 发明人 TAKAHASHI SHIN;YAMADA SHIGEJI
分类号 C09D5/00;C09D123/28;C09J5/02;C09J175/04;(IPC1-7):C09J5/02 主分类号 C09D5/00
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