| 摘要 |
The present invention provides a coupler having a high degree of coupling. The coupler comprises first and second dielectric substrates ( 141 ) and ( 142 ) each having first and second surfaces which are parallel to each other, a ground conductor ( 103 ) which is formed on the first surface of the first dielectric substrate ( 141 ), and two coupling line conductors ( 120 ) and ( 121 ) which are formed on the second surface of the second dielectric substrate ( 142 ) close to each other so as to be electromagnetically coupled to each other, wherein via conductors ( 150 )~( 163 ) and ( 170 )~( 183 ) which are filled in through holes passing through the second dielectric substrate are placed and connected to the two coupling line conductors ( 120 ) and ( 121 ) so as to enhance the degree of electromagnetic coupling, thereby increasing the opposing areas between the coupling line conductors ( 120 ) and ( 121 ) to increase the capacitance.
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