| 摘要 |
In a method to singulate a semiconductor wafer ( 100 ) into chips, trench streets ( 107 ) of predetermined depth ( 105 a) are formed across the first, active wafer surface ( 102 ) to define the outline of the chips ( 101 ). Thereafter, the fabrication of the active first wafer surface is completed and protected. Then, the wafer is flipped to expose the second wafer surface ( 103 ), and the wafer is subjected to a cutting saw. The saw is aligned with the trenches in the first surface so that the saw cuts the second surface along streets ( 106 ), which extend the trenches through the wafer. The saw is stopped cutting at a depth ( 105 b), when the saw streets just coalesce with the trench streets, respectively, whereby the chips are completely singulated. |
