发明名称 CURRENT-CARRYING ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING SAME
摘要 An embodiment of a current-carrying structure (100) includes a first electrically conductive layer (110) and a second electrically conductive layer (120). The second electrically conductive layer is in contact with the first electrically conductive layer along substantially the entire length of the first electrically conductive layer. The second electrically conductive layer is above the first electrically conductive layer. A non-electrically conductive layer (130) is in contact with the first electrically conductive layer and the second electrically conductive layer. A current travels simultaneously through the first electrically conductive layer and the second electrically conductive layer.
申请公布号 KR20050065558(A) 申请公布日期 2005.06.29
申请号 KR20057005264 申请日期 2005.03.25
申请人 FREESCALE SEMICONDUCTOR, INC. 发明人 HWANG LIH TYNG;LI LI
分类号 H01B7/00;H01B7/30;H01B11/12;H01L21/60;H01L21/768;H01L23/538;H01L23/66;H05K1/02;(IPC1-7):H01L21/60 主分类号 H01B7/00
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