发明名称 Method of fabricating nitride semiconductor, method of fabricating nitride semiconductor device, nitride semiconductor device, semiconductor light emitting device and method of fabricating the same
摘要 The method of fabricating a nitride semiconductor of this invention includes the steps of forming, on a substrate, a first nitride semiconductor layer of Al<SUB>u</SUB>Ga<SUB>v</SUB>In<SUB>w</SUB>N, wherein 0<=u, v, w<=1 and u+v+w=1; forming, in an upper portion of the first nitride semiconductor layer, plural convexes extending at intervals along a substrate surface direction; forming a mask film for covering bottoms of recesses formed between the convexes adjacent to each other; and growing, on the first nitride semiconductor layer, a second nitride semiconductor layer of Al<SUB>x</SUB>Ga<SUB>y</SUB>In<SUB>z</SUB>N, wherein 0<=x, y, z<=1 and x+y+z=1, by using, as a seed crystal, C planes corresponding to top faces of the convexes exposed from the mask film.
申请公布号 US6911351(B2) 申请公布日期 2005.06.28
申请号 US20030345377 申请日期 2003.01.16
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 发明人 KIDOGUCHI ISAO;ISHIBASHI AKIHIKO;MIYANAGA RYOKO;SUGAHARA GAKU;SUZUKI MASAKATSU;KUME MASAHIRO;BAN YUZABURO;MORITA KIYOYUKI;TSUJIMURA AYUMU;HASEGAWA YOSHIAKI
分类号 H01L21/20;H01L33/00;H01L33/12;H01L33/40;H01L33/46;H01S5/20;H01S5/22;H01S5/323;H01S5/40;(IPC1-7):H01L21/00 主分类号 H01L21/20
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