发明名称 |
STRUCTURE AND METHOD FOR JOINING METAL MEMBERS |
摘要 |
Sn-Zn alloy is plated on at least one of a first metallic member and a second metallic member, Sn-Ag alloy is used as a solder, the first metallic member and the second metallic member are connected by the solder, and a connection structure of metallic members is therefore produced. Heat degradation of plating and the contact corrosion between solder and plating can thereby be prevented, solderability can be improved, and qualities such as corrosion resistance and connecting strength at the connection structure can be improved. |
申请公布号 |
CA2341725(C) |
申请公布日期 |
2005.06.28 |
申请号 |
CA20002341725 |
申请日期 |
2000.06.30 |
申请人 |
YACHIYO KOGYO KABUSHIKI KAISHA;HONDA GIKEN KOGYO KABUSHIKI KAISHA |
发明人 |
NARITA, MASAYUKI;TAKIKAWA, KAZUNORI |
分类号 |
B23K1/00;B23K1/002;B23K1/18;B23K1/19;B23K1/20;B23K35/00;B23K35/26;B60K15/03;C23C2/08;C25D5/26;C25D7/00;F16L13/08;(IPC1-7):B23K1/20 |
主分类号 |
B23K1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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