Method of making borderless contacts in an integrated circuit

摘要

According to one embodiment ( 100 ), a method of forming borderless contacts may include forming a composite layer over a first insulating layer ( 102 ). A contact hole may be formed through a composite layer and a first insulating layer ( 104 ). A conducting layer may then be formed ( 106 ), including within a contact hole. Portions of a conducting layer may then be removed with a composite layer as a polish stop ( 108 ), and a contact structure may be formed. A first interconnect structure and a second insulating layer may then be formed over a first insulating layer ( 110 and 112 ). A borderless contact pattern may then be etched with a composite layer as an etch stop ( 114 ).