发明名称 |
Casing unit for circuit assembly and method for producing the circuit assembly |
摘要 |
A power circuit section is adhered to a circuit arrangement surface on a heat radiation member to form a circuit assembly. A casing body is mounted on the heat radiation member. The casing body is provided with an opening that exposes at least the upper portion of the power circuit section. A shape retention member is disposed across the opening for interconnecting a peripheral edge of the opening to each other at a plurality of positions. A casing unit is made of a synthetic resin. The shape retention member suppresses a deformation of the casing body due to a shrinkage cavity. After cooling the casing unit, the shape retention member is removed to define a large opening, if desired.
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申请公布号 |
US6911598(B2) |
申请公布日期 |
2005.06.28 |
申请号 |
US20030694756 |
申请日期 |
2003.10.29 |
申请人 |
SUMITOMO WIRING SYSTEMS, LTD. |
发明人 |
ONIZUKA TAKAHIRO;YAMAGUCHI JUN |
分类号 |
H05K5/00;H01R13/518;H05K5/02;H05K7/02;H05K7/20;(IPC1-7):H02G3/08 |
主分类号 |
H05K5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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