发明名称 Composition for eliminating thermosetting resin
摘要 An apparatus containing a composition suitable for eliminating a thermosetting resin is disclosed. In the composition, tetra methyl ammonium hydroxide (TMAH) is included so as to eliminate the thermosetting resin. Accordingly, the composition is suitable for removing a dielectric layer, an organic protective layer, an insulating layer, an alignment layer, black matrices and color filters, etc. made form a thermosetting resin in an LCD or a semiconductor, and permits a reproduction or a rework of the thermosetting resin film.
申请公布号 US6910489(B2) 申请公布日期 2005.06.28
申请号 US20030678085 申请日期 2003.10.06
申请人 LG. PHILIPS LCD CO., LTD. 发明人 RYU KI HYUN
分类号 C09K3/00;H01L21/00;(IPC1-7):B08B3/00 主分类号 C09K3/00
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