ABRASIVE TOOLS FOR GRINDING ELECTRONIC COMPONENTS

摘要

Abrasive tools containing high concentrations of hollow filer materials in a resin bond are suitable for polishing and backgrinding of hard materials, su ch as ceramic wafers and components requiring a controlled amount of surface defects. These highly porous abrasive tools comprise fine grit abrasive grai n, such as diamond abrasive, along with the hollow filler material and resin bond, comprising a backing and an abrasive rim containing a maximum of about 2 to 15 volume percent abrasive grain, the abrasive grain having a maximum gri t size of 60 microns, wherein the abrasive rim comprises resin bond and at lea st 40 volume percent hollow filler materials, and the abrasive grain and resin bond are present in the abrasive rim in a ratio of 1.5:1.0 to 0.3:1.0 grain to bond.